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Devcon HP250

Price:
$176.88
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Product Description

A high-performance, room-temperature-curing epoxy adhesive with superior toughness, impact and chemical resistance for structural bonding applications. 2:1 ratio allows you to use Mark V gun with 2:1 plunger (DA091) for easy use!

  • Gap-filling thixotropic paste
  • Heat resistant to 250°F
  • Long working time [60-65 minutes]
  • Must use [#14410] manual gun for 400ml size (#14415)
  • Must use DA 091 plunger for the 50 ml size
  • Bonds to plastics

Accessory Products

Dispensing Guns
50 ml - 50 ml 1:1 Manual Gun
400 ml - VBM 400x MR 2:1


Downloads

Download data sheet


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